Production
of photomasks

350 nm
Topological norms

5″, 6″
Size of photomasks

Binary
Type of photomasks

Quartz
Substrate material

Production and supply of photomasks
for projection and contact photolithography

Manufacturing of photomasks is carried out for the production of integrated circuits with design rules up to 350 nm on the basis of special technological equipment, providing generation of topological image of the integrated circuit on photomasks according to the given control information, certification of photomasks on compliance to the design data and technical requirements of the customer

Photomask for projection photolithography
Topological norms: 0,35 µm
Size: 152х152х6,35 mm (6025)
Scale: 5:1
Substrate material: Synthetic quartz
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Photomask for projection photolithography
Topological norms: ≥ 1,5 µm
Size: 127х127х2,3 mm (5009)
Scale: 5:1, 10:1
Substrate material: Synthetic quartz or borosilicate glass
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Photomask for contact photolithography
Topological norms: ≥ 0,5 µm
Size: 127х127х2,3 mm (5009)
Scale: 1:1
Substrate material: Synthetic quartz or borosilicate glass
More details

Related Services

Photomask design

  • Conducting input control of topology;
  • Designing photo templates in GDSII, OASIS formats;
  • Conducting output control of the topology of photomasks;
  • Preparation of control programs for technological equipment;
  • Automated control of defects in the working field of the photomask (including logging of control results)

Photomask manufacturing

  • Manufacturing VLSI reticles with design rules up to 0.35 µm in the scale 5:1 a d 4:1 for projection photolithography (ASML, Canon, Nikon);
  • Manufacturing micron LSI reticles of the scale 5:1 for projection lithography (KBTEM-OMO, Planar);
  • Manufacturing reticles of the scale 10:1 for step-and-repeat systems (AER);
  • Manufacturing photomask of the scale 1:1 for contact photolithography

Photomask repair and certification

  • Measuring linear dimensions and coordinates, determination of uniformity of linear dimensions;
  • Measuring the coordinates of photomask elements and determining the location accuracy of photomask elements;
  • Measurements of the coordinates of the elements of the set of photomasks and determination of the compatibility of topological layers in the set;
  • Laser retouching of defects in the photomask working field;
  • Pellicle cleaning and installation (single-sided / double-sided);
  • Photomask hillshade
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